CAS Latency (CL): CAS latency is a measure of the delay between the memory controller requesting data and the data being available. Specific CL values may vary; common values for DDR4 include 15, 16, 17, etc.
Error Checking: Non-ECC (Error-Correcting Code) – ECC is not typically found in laptop RAM, as it’s more commonly used in server environments.
Memory Organization: The organization is typically mentioned in terms like 1Rx8 or 2Rx8, indicating the arrangement of memory chips on the module.
Form Factor: SODIMM, designed for smaller form factor systems like laptops.
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Capacity: 8GB – This refers to the amount of memory the module can store, measured in gigabytes (GB).
Memory Type: DDR5 – This indicates that the memory module follows the DDR5 (Double Data Rate 5) standard. DDR5 is a type of synchronous dynamic random-access memory (SDRAM) commonly used in computer systems for higher performance.
Module Type: JM4800 U-DIMM – This specifies the module type, where “U-DIMM” stands for Unbuffered DIMM. Unbuffered DIMMs are the most common type of memory modules used in consumer-grade computers.
Memory Organization: 1Rx16 – This indicates the memory organization. In this case, it’s a 1-rank module with 16 data pins.
Memory Chip Configuration: 1Gx16 – This denotes the organization of memory chips on the module. In this case, it’s organized as 1 Gigabit x 16, suggesting the use of 16 memory chips each with a capacity of 1 gigabit.
CAS Latency (CL): CL40 – CAS Latency is the time it takes between a command being sent to the memory and the data being available to read. CL40 is relatively high, and lower values are generally better for performance.
Voltage: 1.1V – This indicates the operating voltage of the memory module. In this case, it operates at 1.1 volts.
